Ensure the substrate is sound, smooth, level, clean, dry and free of any dust, dirt, wax, loose paint, incompatible curing compounds or fire retardant chemicals, fungicides, release agents, sealers, or any other foreign substances that might interfere with a good bond.
- When installing thin gauged wood, solid or engineered, irregular substrates may telegraph through as adhesive pulls wood down during curing stages. Therefore substrates must be properly leveled to prevent telegraphing
- Fill all cracks, holes and low spots with polymer modified cementitious compound and allow to fully cure before applying adhesive
- High spots must be ground level
- Substrate, adhesive and wood flooring must be acclimated in an enclosed building with the HVAC operational and running for at least 72 hours before, during and after the installation
- The installation temperature and relative humidity must be controlled between 15°C and 30°C, and between 30% and 65% relative humidity, subject to the floor manufacturers requirements. Open time will vary with temperature and humidity or porosity of the substrate
- Wood flooring must be exposed to the air when being acclimated. However, follow the wood flooring manufacturers guidelines regarding site conditions and installation