Osmo D3 Express Wood PVA Adhesive

Osmo D3 Express Wood PVA Adhesive is a ready to use, water-resistant wood adhesive based on polyvinyl acetate homopolymer emulsion (PVA). It is specially formulated to conform to D3 according to DIN EN 204. It has excellent bond strength on all types of wood including flat laminates synthetic resin board and chipboard. It's also suitable for fixing paper, cardboard, paper or textile-backed PVC cloth to wood. Can also be used to bond exterior timber such as window-frames, external doors and other joinery.

• Looking for an adhesive for installing wood flooring? Use Osmo MS Advance Wood Floor Adhesive

For best results, ensure the surface to be sealed or glued is clean, dry and free from dust, dirt, grease or any other surface contaminants prior to application.

Always do a test area before starting any project to assess product suitability and performance. Follow the manufacturers instructions on the container at all times.

1. Make sure the product is thoroughly mixed before use
2. Apply evenly to one of the surfaces
3. Clamp both surfaces together
4. Using a damp, lint-free cloth, carefully remove any excess glue from furniture or wood immediately after clamping
5. Ensure that ALL excess glue is removed from furniture or wood as this may affect the penetration of any colour or wood finish that is later applied
6. Allow to dry for at least 20 minutes before handling

Please note:

• Full water resistance is achieved after 7 days
• This product must be stored air-tight between 5 - 25°C for a maximum of 12 months from production date
• Do not allow Osmo D3 Express Wood PVA Adhesive to freeze

Is Osmo D3 Adhesive safer than other glues?

In comparison to some glues, Osmo's is water-based and low in VOC making it a safer selection.

What is a D3 adhesive?

The D3 prefix denotes the level of water resistance that the adhesive has. There are four levels of water and weather resistance, D1, D2, D3 and D4. D3 has a good all round water resistance and is the most common grade used in timber bonding applications.